Kolink Core TX-8 Thermal Paste – 1.5 g

Kolink Core TX-8 thermal paste is formulated to fill small gaps between a processor and its cooler, helping to transfer heat effectively. Its aluminium oxide-based formula has a thermal conductivity of 8 W/mK and requires no curing time. The electrically non-conductive paste comes in a 1.5 g pack with an applicator.

Key features

• Aluminium oxide-based thermal compound
• Thermal conductivity of 8 W/mK
• Operating temperature range from -150°C to 350°C
• Electrically non-conductive
• No curing time required
• Applicator included

Technical specifications